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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Boeing, GM Complete Sale of HRL Laboratories to IBM

09/01/2026 | Boeing
Boeing and GM announced that the companies have completed the sale of HRL Laboratories, LLC, which was a 50/50 joint venture between Boeing and GM, to IBM. Financial details of the transaction were not disclosed.

Indium to Explore the Critical Materials and Packaging Process Connection at CPRIM 2026

09/01/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and reliability at the Conference on Advanced Packaging Reliability Technology and Interconnect Materials (CPRIM) 2026, September 4, in Guangzhou, China.

Curtiss-Wright Wins $40M Leidos Contracts for U.S. Army Defense Program

09/01/2026 | Curtiss-Wright Corporation
Curtiss-Wright Corporation announced that it has been awarded contracts by Leidos valued at approximately $40 million to support the production of the U.S. Army’s Indirect Fire Protection Capability Increment 2 (IFPC Inc 2) system.

Express LUCK Selects MemryX for AI-Enabled Smart Manufacturing Operations

08/31/2026 | PRNewswire
MemryX Inc., a provider of high-efficiency AI acceleration technology, announced that Express LUCK has deployed a MemryX-powered edge AI system within its manufacturing operations.

S-Transistors Raises €2.6M to Advance Scalable Quantum Computing Platform

08/31/2026 | VTT
Newly launched Finnish startup S-Transistors, originating from VTT Technical Research Centre of Finland, has raised €2.6 million in pre-seed funding to pioneer a fundamentally new class of integrated circuits based on superconducting transistors.
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