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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

The Test Connection, Inc. Becomes First Test Engineering Company in Space

06/30/2026 | The Test Connection Inc.
TTCI recently contributed engineering time and resources to the Observation & Detection Interpreted by Neural-networks (ODIN) project, a student-developed payload by Capitol Technology University in Laurel, Maryland.

VisionWave Signs Definitive Agreement to Acquire Controlling Interest in Meteor Aerospace

06/30/2026 | Globe Newswire
VisionWave Holdings, Inc., a defense technology company developing advanced artificial intelligence, autonomous systems and next-generation security technologies, announced that it has entered into a definitive binding agreement to acquire a 51% controlling interest in Meteor Aerospace Ltd., a privately held Israeli aerospace and defense company recognized for its portfolio of advanced unmanned systems, precision defense technologies and integrated national security solutions.

Where Is Direct Imaging Headed?

06/30/2026 | Marcy LaRont, I-Connect007
At the 2026 EIPC Summer Conference in Lithuania, Dennis Pusch, sales and business development manager for direct imaging at Schmoll Maschinen, examined the latest developments in UV light source technologies and the real-world trade-offs manufacturers must consider. If you're evaluating an imaging system upgrade or simply want to understand where the technology is headed, this interview is well worth your time.

IBM Debuts World’s First Sub-1 Nanometer Chip Technology

06/29/2026 | IBM
IBM unveiled a major semiconductor breakthrough with the introduction of the world’s first sub-1 nanometer (nm) chip technology, featuring a revolutionary transistor architecture at the 0.7 nm, or 7 angstrom node.

Building Better HDI Boards: Driving Quality Through Lamination

06/29/2026 | Marcy LaRont, I-Connect007 Magazine
All4-PCB, a technology-focused supplier serving the PCB, IC substrate, chemical milling, and LTCC markets, works with manufacturers across North America to deliver equipment, materials, and process solutions that address the lamination challenges of HDI, advanced packaging, and complex multilayer designs. Under the leadership of Managing Director Ralph Jacobo, the company has continued expanding its support for advanced electronics manufacturing operations.
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