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KYZEN Unveils Next-Generation Aqueous Cleaning Solution at IPC APEX EXPO 2022
December 20, 2021 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, has been working tirelessly on the release of their newest aqueous product. The company will be announcing the newest addition to its award-winning AQUANOX line at the IPC APEX EXPO 2022 happening January 25 – 27 at the San Diego Convention Center in San Diego, CA.
This new innovative aqueous product was designed to be the work horse of electronics cleaning applications. It will quickly remove polymeric no-clean flux, as well as traditional lead-free and eutectic tin-lead residues while providing a long tank life and is safe for multi-pass applications. As with all of KYZEN's AQUANOX products, it is eco-friendly, low VOC, and compatible with today’s cleaning equipment.
KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analyst paired with KYZEN Analyst Data Services will complete the optimization and provide you with a worry-free process.
Many long and hardworking hours were spent in the lab perfecting this chemistry and the KYZEN team is very excited to reveal the name of the new product along with its features at the show. For those attending the show, they can inquire about the new AQUANOX product at the KYZEN Booth #2101.
No matter what you’re cleaning, KYZEN has products for your process. To keep up with all the latest news regarding KYZEN at IPC APEX EXPO 2022 and other events, visit kyzen.com.
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"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.