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Northrop Grumman to Produce First Hypersonic Glide Phase Interceptor

09/30/2024 | Northrop Grumman
The U.S. Missile Defense Agency (MDA) will proceed with Northrop Grumman Corporation for the Glide Phase Interceptor (GPI) program, the first-of-its-kind defensive countermeasure against hypersonic missile threats. Working in close partnership with MDA, the three-year developmental effort produced a purpose-built, innovative design capable of defeating existing and emerging hypersonic threats.

Aismalibar to Showcase Thermal Management Solutions for EV Battery Systems at The Battery Show North America 2024

09/27/2024 | Aismalibar
Aismalibar, a leader in innovative thermal management materials, will be presenting its newest solutions for electric vehicle (EV) battery systems at The Battery Show North America from October 7-11, 2024. Located at Huntington Place, Detroit, MI, Aismalibar will exhibit at booth 6231, unveiling a range of cutting-edge Thermal Interface Materials (TIMs) designed to improve the safety, performance, and longevity of EV batteries.

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

09/27/2024 | ANSYS
Ansys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.

Silicon to Systems: A Wake-up Call for the Industry

09/26/2024 | Andy Shaughnessy, Design007 Magazine
Duane Benson, founder of Positive Edge, has been working with silicon and packaging for longer than some of our newer readers have been alive. We asked him to share his thoughts on silicon to systems, which Duane says is much more than a buzzword—it’s a wake-up call for the industry.

Connect the Dots: Designing for Reality—Outer Layer Imaging

09/26/2024 | Matt Stevenson -- Column: Connect the Dots
Welcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
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