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Bowman Technical Team Appoints Principal Engineer
December 20, 2021 | BowmanEstimated reading time: Less than a minute
Bowman, a US manufacturer of XRF quality control instruments, has announced a principal addition to its headquarters organization.
Xin Jiang joined the company as Principal Electrical/Firmware Engineer. He holds an MSE (Master of Science, Electrical Engineering) and has 30+ years of experience in digital circuits, embedded software, and product design. He has an impressive record with UL, CE, and FDA compliance and testing, and will lead Bowman’s effort in designing electronics for automated XRF tools and next-generation instruments.
In his previous posts, he specialized in HPLC chromatography and X-ray technology for medical device applications, and was a consulting test engineer for Teradyne, a semiconductor test equipment provider.
His responsibilities at Bowman cover firmware, product design, and regulatory compliance; he reports to Engineering Manager, Robert Magyar.
Bowman is a leading manufacturer of precision XRF plating measurement systems, providing equipment evaluation, selection, commissioning, maintenance and quality systems modernization throughout North America, South America, and Eurasia.
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Northrop Grumman to Produce First Hypersonic Glide Phase Interceptor
09/30/2024 | Northrop GrummanThe U.S. Missile Defense Agency (MDA) will proceed with Northrop Grumman Corporation for the Glide Phase Interceptor (GPI) program, the first-of-its-kind defensive countermeasure against hypersonic missile threats. Working in close partnership with MDA, the three-year developmental effort produced a purpose-built, innovative design capable of defeating existing and emerging hypersonic threats.
Aismalibar to Showcase Thermal Management Solutions for EV Battery Systems at The Battery Show North America 2024
09/27/2024 | AismalibarAismalibar, a leader in innovative thermal management materials, will be presenting its newest solutions for electric vehicle (EV) battery systems at The Battery Show North America from October 7-11, 2024. Located at Huntington Place, Detroit, MI, Aismalibar will exhibit at booth 6231, unveiling a range of cutting-edge Thermal Interface Materials (TIMs) designed to improve the safety, performance, and longevity of EV batteries.
TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design
09/27/2024 | ANSYSAnsys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.
Silicon to Systems: A Wake-up Call for the Industry
09/26/2024 | Andy Shaughnessy, Design007 MagazineDuane Benson, founder of Positive Edge, has been working with silicon and packaging for longer than some of our newer readers have been alive. We asked him to share his thoughts on silicon to systems, which Duane says is much more than a buzzword—it’s a wake-up call for the industry.
Connect the Dots: Designing for Reality—Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.