Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open
December 28, 2021 | SMTAEstimated reading time: Less than a minute
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at the DoubleTree by Hilton Hotel in San Jose, California.
The technical sessions on Tuesday and Wednesday are organized into three tracks: Wafer-Level Packaging (WLP), 3D Packaging, and Advanced Manufacturing and Test (AMT). The WLP track features sessions on materials, reliability, metrology, processing, and new technology, such as Fan-Out WLP. The 3D Packaging track features sessions on design, test, characterization, wafer bonding, chip stacking, and processing for fan-out. The AMT track features sessions on process materials, equipment, inspection, and more.
Packaging technology experts Joe Dickson, WUS PCB Ltd; Tanja Braun, Ph.D., and Michael Topper, Fraunhofer IZM; John Lau, Ph.D., Unimicron; and Jeff Gotro, Ph.D., InnoCentrix, LLC, are scheduled to lead half-day Professional Development Courses on February 17, 2022.
Share on:
Suggested Items
Kaynes Technology Acquires Canada-Based August Electronics
05/09/2025 | PRNewswireAugust Electronics Inc. is pleased to announce that it has entered into a definitive agreement to be acquired by Kaynes Canada Limited, a wholly owned step-down subsidiary of Kaynes Technology India Limited, a leading Electronics System Design & Manufacturing (ESDM) company. The transaction is expected to close by the end of May 2025, subject to customary regulatory approvals and closing conditions.
LITEON Technology Reports Consolidated April Sales of NT$13.4 Billion Up 27% YoY
05/09/2025 | LITEON TechnologyLITEON Technology reported its April consolidated revenue of NT$13.4 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 27% YoY.
Ultrahuman Expands its American Factory’s Manufacturing Capacity
05/09/2025 | GlobeNewswireUltrahuman, a pioneer in health optimization technology, has announced that it’s ramping up its capacity of the Ring AIR. Ultrahuman’s manufacturing facility (UltraFactory) in partnership with SVtronics, a US-based electronics manufacturing business, has been operational in Plano, Texas, since November 2024.
Kyocera Licenses Quadric’s Chimera GPNPU AI Processor IP
05/08/2025 | BUSINESS WIREQuadric announced that Kyocera Document Solutions Inc. (hereinafter: Kyocera) has licensed the Chimera™ general purpose neural processor (GPNPU) intellectual property (IP) core for use in next generation office automation system on-chip (SoC) designs.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.