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Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open
December 28, 2021 | SMTAEstimated reading time: Less than a minute
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at the DoubleTree by Hilton Hotel in San Jose, California.
The technical sessions on Tuesday and Wednesday are organized into three tracks: Wafer-Level Packaging (WLP), 3D Packaging, and Advanced Manufacturing and Test (AMT). The WLP track features sessions on materials, reliability, metrology, processing, and new technology, such as Fan-Out WLP. The 3D Packaging track features sessions on design, test, characterization, wafer bonding, chip stacking, and processing for fan-out. The AMT track features sessions on process materials, equipment, inspection, and more.
Packaging technology experts Joe Dickson, WUS PCB Ltd; Tanja Braun, Ph.D., and Michael Topper, Fraunhofer IZM; John Lau, Ph.D., Unimicron; and Jeff Gotro, Ph.D., InnoCentrix, LLC, are scheduled to lead half-day Professional Development Courses on February 17, 2022.
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