-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Hanza Receives Certificate for Information Security
December 29, 2021 | HANZAEstimated reading time: Less than a minute
HANZA Holding AB, a leading provider of complete manufacturing solutions, has received ISO 27001 certification for the Information Security Management System (ISMS). This is a further confirmation of HANZA’s commitment to fulfil and comply with the highest level of international requirements regarding data security and customer data protection.
"Secure information management is crucial for a contract manufacturer. The certification means that we maintain a high level of security controls, information technology and cybersecurity for our customers." says Erik Stenfors, CEO of HANZA."
Following an extensive audit process, the certification was issued by Lloyd’s Register Quality Assurance Limited. Certificate holders are continuously and rigorously audited to ensure they follow the required procedures and policies and show continuous improvement.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Molex Accelerates Supply Chain Transformation with Celonis AI
04/17/2026 | BUSINESS WIRECelonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
At KYZEN, Cleaning is All About Reliability
04/17/2026 | Real Time with... APEX EXPOJason Schwartz discusses KYZEN's advanced cleaning solutions for PCB assembly with Dan Beaulieu at APEX EXPO 2026. KYZEN has a 35-year legacy in defluxing, innovative real-time process control, and commitment to ensuring electronic reliability. How KYZEN partners with manufacturers through process audits and lab testing to maintain optimal cleaning standards is part of this conversation.
Molex Accelerates Supply Chain Transformation with Celonis AI
04/16/2026 | BUSINESS WIRECelonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.