-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Epec Invests Over $1M in New Equipment at Netvia Location
December 29, 2021 | Epec Engineering TechnologiesEstimated reading time: 1 minute
Epec Engineered Technologies announced that it has invested more than $1M in new equipment at its NetVia Group PCB manufacturing facility located outside of Dallas, Texas.
Specifically, they have added an Orbotech Dimension 6 AOI with Microvia inspection capability, a Mivatek 200L LED laser direct imaging system, a Microcraft EMMA Flying probe electrical tester with 1000V HiPot testing capability, along with several of the newest high-end metallurgical microscopes and an automatic metallographic grinding and polishing machine to dramatically improve throughput in our laboratory.
“Since the acquisition of NetVia by Epec Engineered Technologies in November of 2020, the growth of our business has required that we increase our capacity and our equipment resilience to ensure that we can meet our customers’ delivery and technology needs. We are dedicated to ensuring that we can manufacture high-technology rigid circuit boards and rigid-flex PCBs for our customers, which will require us to increase our equipment in terms of capacity and capability every year,” stated Ed McMahon, CEO of Epec Engineered Technologies.
The equipment that has been installed is the highest technology available in terms of speed and accuracy which increases NetVia’s ability to manufacturer PCB with 3/3 lines and spaces, thousands of test points per part, and ensuring that PCBs with even the smallest microvias are inspected using machine technology.
Jeff Forbus, President of NetVia, said: “Our team is dedicated to our customer success and with the addition of this equipment we can now move even faster to help our customers get their product to market faster. Printed circuit boards require a constant focus and attention to detail and these additions are going to help us with both.”
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.