SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
Epec Invests Over $1M in New Equipment at Netvia Location
December 29, 2021 | Epec Engineering TechnologiesEstimated reading time: 1 minute
Epec Engineered Technologies announced that it has invested more than $1M in new equipment at its NetVia Group PCB manufacturing facility located outside of Dallas, Texas.
Specifically, they have added an Orbotech Dimension 6 AOI with Microvia inspection capability, a Mivatek 200L LED laser direct imaging system, a Microcraft EMMA Flying probe electrical tester with 1000V HiPot testing capability, along with several of the newest high-end metallurgical microscopes and an automatic metallographic grinding and polishing machine to dramatically improve throughput in our laboratory.
“Since the acquisition of NetVia by Epec Engineered Technologies in November of 2020, the growth of our business has required that we increase our capacity and our equipment resilience to ensure that we can meet our customers’ delivery and technology needs. We are dedicated to ensuring that we can manufacture high-technology rigid circuit boards and rigid-flex PCBs for our customers, which will require us to increase our equipment in terms of capacity and capability every year,” stated Ed McMahon, CEO of Epec Engineered Technologies.
The equipment that has been installed is the highest technology available in terms of speed and accuracy which increases NetVia’s ability to manufacturer PCB with 3/3 lines and spaces, thousands of test points per part, and ensuring that PCBs with even the smallest microvias are inspected using machine technology.
Jeff Forbus, President of NetVia, said: “Our team is dedicated to our customer success and with the addition of this equipment we can now move even faster to help our customers get their product to market faster. Printed circuit boards require a constant focus and attention to detail and these additions are going to help us with both.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.