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ZenaTech Begins In-House PCB Flight Testing for NDAA-Compliant Blue UAS

08/12/2026 | BUSINESS WIRE
ZenaTech, Inc., announces that its U.S.-based subsidiary ZenaDrone has commenced flight testing of its custom-designed printed circuit boards (PCBs) at its UAE manufacturing and testing facility, integrating the proprietary boards directly into its ZenaDrone 1000 and IQ Nano drone platforms.

LITEON Invests in DenseLight to Strengthen Optical Communications for AI Infrastructure

08/04/2026 | LITEON Technology
LITEON Technology announced a strategic investment in DenseLight Photonics, a provider of indium phosphide (InP) optical communication components through its Singapore-based operating subsidiary, with a total transaction value of US$34.3 million.

A.P.E. Adds Cameras, Monitors to Boost Precision Rework Stations

08/03/2026 | A.P.E.
A.P.E. is adding optional cameras and monitors for the TRIDENT Benchtop SMT Rework and Repair Station as well as for the INTRUDER, a complete, advanced hot air BGA rework station with split vision placement/removal capability.

Dymax Launches 9310 Adhesive for High-Reliability PCB Reinforcement

07/30/2026 | Dymax
Dymax, a global manufacturer of light-curing materials and equipment, announces the launch of its 9310 adhesive engineered to reinforce fine-pitch, leadless components on printed circuit boards.

TopLine Ships JEDEC Matrix IC Trays and Waffle Packs from Stock

07/30/2026 | TopLine
TopLine ships a complete range of JEDEC Matrix IC trays and Waffle Packs for a wide variety of components, from stock, eliminating long wait times for components, including BGA, QFN, QFP, PLCC, TSOP, and many others.
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