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Hentec Industries/RPS Automation Anticipates a Strong Sales Year in 2022
January 4, 2022 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that due to pent-up demand throughout this past year Hentec/RPS anticipates strong sales activity in 2022 and we foresee robust growth for our entire product line of soldering systems. Our Vector and Valence selective soldering systems feature ease of operation programming software our customers describe as simplistic elegance in operation. The newest addition to our product lineup, the Valence selective soldering system utilizes an electromagnetic solder pump to provide our customers with greater efficiency, better process repeatability and enhanced quality.
The continued need for gold removal, component re-conditioning, tin mitigation and BGA de-balling has increased demand for our Odyssey robotic hot solder dip machines for high reliability and military applications. Our Pulsar solderability test system utilizes the highly proven dip-and-look test method to determine the solderability of various through-hole and SMT components to ensure quality circuit board assembly. Throughout 2022, Hentec/RPS will continue to provide new product innovations to meet our customers printed circuit board assembly needs.
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Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.