-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Highlighting Award-winning True 3D Inspection Solutions at IPC APEX EXPO 2022
January 5, 2022 | Koh YoungEstimated reading time: 5 minutes

Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions and the Premier sponsor of IPC APEX Expo, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 25-27, 2022 in San Diego, California.
After a lengthy lock-down, Koh Young will embrace the comprehensive safety and hygiene protocols in place to ensure a safe environment for attendees, so that the industry can meet face-to-face. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1717) and the Factory of the Future Pavilion (1701). The following is just a glimpse into what Koh Young will have in store for our visitors.
Solder Paste Inspection (SPI)
In 2002, we introduced the concept of 3D measurement-based solder paste inspection – and it revolutionized the inspection industry. Today, manufacturers recognize the value of the 3D measurement data and use the data to improve the print process, in turn, improving production yield and quality. Today, 3D SPI has become a standard requirement for SMT lines – it is no longer optional. The KY8030-3 is our SPI workhorse, and the most popular SPI solution in the electronics manufacturing market. With a patented dual-projection technology, we deliver trustworthy and repeatable measurement data, which manufacturers can use to reliably optimize the print process.
- KY8030-3: Industry’s Fastest True 3D SPI Solution with Integrated Auto-Repair Dispenser
- aSPIre3: Industry’s Highest Performing True 3D SPI Solution
Printing Process Optimization
The award-winning Koh Young Process Optimizer (KPO Printer) solution is an AI-based automatic print process optimizer. This system improves the printer offset, as well as critical printer parameters like squeegee speed, print pressure, and separation speed. KPO performs an automated DOE to determine the optimum printing parameters for the best print quality. As a result, manufacturers can optimize the print process, without the need for a dedicated print process expert. Furthermore, KPO monitors and perfects parameters in real-time to guarantee quality despite environmental changes.
- KPO Printer: Award-winning AI-powered print process control software
Automated Optical Inspection (AOI)
The Koh Young 3D AOI Zenith delivers perfect inspection performance with True 3D measurement technology. In the 2D inspection world, false calls and escapes are unavoidable. To solve this problem, we took a different approach. We based our solution on full 3D measurement technology, not 2D technology and its inherent shortcomings or 2D with some 3D capabilities bolted-on to help. At Koh Young, the Zenith measures all components in True 3D. We find the component body based on true 3D profilometric information. Using this approach, we provide trustworthy inspection results, regardless of component or board color variations. When our 3D measurement data meets artificial intelligence, we can deliver even more advantages to manufacturers.
- Zenith Alpha: Best Value True 3D Automated Optical Inspection Solution
- Zenith: Industry’s Fastest True 3D AOI Solution
- Zenith 2: Revolutionary True 3D AOI Delivering Incomparable Capabilities
- Meister D: Industry’s Leading Inspection Systems for Advanced Packaging & Semiconductors
Automated Pin Inspection (API)
Built on its world-class True3D™ AOI technology, new enhancements help it break through barriers associated with inspecting products with a mix of both Pins and SMDs. The complete KY-P3 lineup provides an automated back-end solution combining advanced high-resolution optics and innovative AI-powered vision algorithms for single pin, press-fit, and Final Optical Inspection, as well as for pins inside a connector shroud, while also inspecting traditional SMDs on the same product. Because of its quantitative measurement-based approach, accuracy and repeatability is unsurpassed.
- KY-P3: Industry-awarded breakthrough in 3D Automated Pin Inspection
Dispense Process Inspection (DPI)
The award-winning Neptune is the industry’s first 3D optical measurement solution for transparent material inspection. Using Koh Young LIFT technology (Laser Interferometry for Fluid Tomography), the Neptune delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry. With its Machine-Learning algorithm, the Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting. It also identifies bubbles, cracks, and other defects in coating. It also measures underfill, epoxy, bonding, glue, potting, flux, and more to deliver an exact measurement of transparent and translucent materials.
- Neptune C+: Multiple Award-winning True 3D In-Line Dispensing Process Inspection (DPI) Solution
Process Control Software
AI-powered KSMART solutions help automate process control, while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve production, increase quality, and lower costs by eliminating variances, false calls, and escapes.
- KSMART: Seamless Smart Factory Software Suite Turning Data into Insights
Description automatically generatedFactory of the Future Pavilion & Technical Poster Session
Koh Young was selected to highlight how it is solving significant business challenges by applying connectivity to modernize industry processes. Across the aisle from our booth, in the Factory of the Future pavilion, Koh Young will discuss how to leverage IPC-CFX with Koh Young AI-powered technologies to help manufacturers realize a smart factory. These tools collect factory data on defects, optimization, traceability, and more to improve metrics, increase quality, and lower costs. Yet, successful CFX implementation on the shopfloor requires confidence that equipment has been qualified to IPC-CFX. In this presentation, we will explore how Koh Young successfully applies real-time data to improve the production process by converting data into process knowledge using CFX and other software tools. Combined with IPC communication standards, the gates to a smart factory are open to anyone. If you cannot make it to the pavilion, grab a drink, lunch, or an ice cream and mingle with Koh Young experts at the poster sessions in booth 3815 to discuss how to use IPC-CFX to enable a smart factory.
To learn more about how our solutions boost your quality, visit us at the IPC APEX Expo in Booth 1717 during 25-27 January 2022 at the San Diego Convention Center in San Diego, California. You can register to attend the in-person conference and exposition, here.
Check out this additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal (a free eBook available for download)
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e Book library here
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).