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The low melting temperature of SnBi alloys (138°C) makes them attractive for assembling thermally warpage-prone high-density microelectronic packaging. However, Bi has a high propensity for electromigration and segregation at the anode under high current density conditions. This can lead to potentially brittle solder joints with high electrical resistance over time in the field. There is a need to mitigate this shortcoming and develop SnBi solder joints that maintain their performance and reliability over the product life. This iNEMI project will explore the potential to reduce electromigration in low-height solder joints by taking advantage of mechanical and/or chemical back stresses.
Objective
The overall project objective is to determine the boundaries of the envelope formed by joint height, temperature, current density and PCB finishes within which the solder joint will operate reliably over the product life.
The project has multiple phases planned. The first phase will:
- Establish an appropriate test vehicle for electromigration study of solder joints, including a convenient means of achieving various joint heights.
- Investigate the role of back pressure in reducing electromigration in eutectic SnBi solder joints by determining the rate of electromigration of SnBi solder joints with and without diffusion barriers as a function of current density, temperature and joint height.
The Electromigration of SnBi Solder for Second-Level Interconnect project is open for sign-up until January 31, 2022. Two call-for-participation webinar sessions are scheduled to introduce the project. These webinars are open to industry; advance registration is required.
Registration
Tuesday, January 11, 2022
10:00-11:00 a.m. EST (Americas)
3:00-4:00 p.m. CET (Europe)
11:00-12:00 p.m. CST (China)
Register for this webinar
Thursday, January 13, 2022
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (Americas) on January 12
Register for this webinar
