Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Indium Corporation Products ‘Live@APEX’
January 11, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Jan. 25-27, San Diego, California, U.S.
Live@SMTAI is a collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, its industry partners, and, most importantly, the customers who get to experience the equipment and materials in a live-action environment.
This year’s program will highlight Indium Corporation materials, including:
- Core 230-RC – flux-cored robotic soldering wire
- CW-807 – electronics soldering cored wire
- Durafuse™ LT – patent-pending low-temperature alloy system
- FP-500 – no-clean flux pen
- Indium8.9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
- Indium510L – solder paste designed for laser reflow
- Indium12.8HF – jetting and microdispense solder paste
- Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
- TACFlux® 089 – no-clean flux formulated for SnAgCu and SnAg solders
- TACFlux® 089HF – halogen-free, no-clean flux formulated for SnAgCu and SnAg solders
You can see these products at the following partner booths:
- Apollo Seiko (booth #2141)
- AIR-VAC Engineering (booth #1343)
- Essemtec (booth #3040)
- Finetech (booth #2100)
- ITW EAE (booths #1433 and #1701)
- JBC Tools (booth #2133)
- Koh Young Technology (booths #1701 and #1717)
- KYZEN (booth #2101)
- Microcare (booth #909)
- NSW Automation (booth #2417)
- PARMI USA (booth #1108)
- Pillarhouse International (booth #932)
- Smart Sonic (booth #2522)
- Trans-Tec America (booth #1932)
- Universal Instruments Corporation (booth #2233)
- VERMES Microdispensing (booth #2417)
- ZESTRON Corporation (booth #1910)
By demonstrating Indium Corporation products on live equipment at the SMTAI show, attendees get an accurate and honest depiction of the material’s performance. If you see an Indium Corporation product running in a booth, be sure to Tweet and tag @IndiumCorp or use the hashtag #LiveatAPEX.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.