Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
Global Sourcing Spotlight: The New Landscape of Manufacturing 
Nolan’s Notes: Five Key Changes to APEX EXPO
Cirexx Adds to Excellon Cobra Laser Fleet
January 31, 2022 | ExcellonEstimated reading time: Less than a minute
Cirexx International has acquired and installed a fifth Excellon Cobra laser machine. The hybrid Laser and is equipped with both CO2 and UV laser technology. It is designed to “drill” holes, “rout” profiles and micro-machine fine features in printed circuit boards and specifically flex circuits. The machine comes with the upgraded controller, latest software, High Speed Intelligent Scanners and variable power high pulse energy lasers.
Mike Sparidaens of Excellon said, “Cirexx is realizing the benefits from the enhanced technology of this next generation Cobra-II laser. As our product evolves, we look forward to continue being part of Cirexx's technology roadmap for many years to come.”
Philipp Menges, Cirexx President/CEO commented, “We began using the COBRA lasers to make fine and very accurate features in flex circuits, but we are using them more and more these days to make micro vias in HDI boards. The quality and reliability of Excellon machines means to me that they will be running like workhorses without downtime. Add the outstanding Excellon service that we receive from Mike and his team, and we have a true win-win.”
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Deep Space Energy Raises €930K Pre-Seed to Power Moon and Satellites
02/11/2026 | Deep Space EnergyLatvian startup Deep Space Energy has closed its pre-seed round by raising €350K, led by Outlast Fund and Linas Sargautis, an angel investor and a former co-founder of NanoAvionics.
SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
02/11/2026 | PRNewswireWorldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.
New Research Group: AT&S Strengthens Microelectronics at TU Graz
02/11/2026 | AT&SAT&S is setting another strategic milestone for the technological future of Europe and is funding the establishment of a new research group at Graz University of Technology (TU Graz) in the field of microelectronics with a focus on IC substrates and advanced packaging technologies.
Smart City Technologies Gain Global Momentum Across Core Urban Services
02/11/2026 | Berg InsightBerg Insight,released the latest edition of its comprehensive smart city technology report comprising in-depth studies of five key technology areas – smart street lighting, smart parking, smart waste collection, urban air quality monitoring and smart city surveillance.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.