Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Indium Expert to Present at Wafer-Level Packaging Symposium
February 3, 2022 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr. Dongkai Shangguan, strategic advisor, at the Surface Mount Technology Association’s Wafer-Level Packaging Symposium, Feb. 15-17, San Jose, Calif., U.S.
As advanced packaging continues to drive towards heterogeneous integration, new materials need to be developed to address the many challenges faced in the assembly process. In his presentation Innovative Materials for Advanced Semiconductor Packaging, Dr. Shangguan will cover cutting-edge materials for this technology, including novel flux formulations and adhesive agents for wafer/die bonding, interactions between the flux material and various dielectric materials on the wafer, and materials for thermal management in high density packaging. The presentation will introduce the different processes and the associated materials, and the benefits and disadvantages of the various options will be discussed in detail. Proper selection and application of interconnect materials for the various assembly processes is crucial to ensuring a high production yield during the assembly process for reliable wafer-level packages.
Dr. Shangguan is a strategic advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also serves as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a B.S. in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K. and The University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books and more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 25 U.S. patents and several foreign patents.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.