The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
ASMPT Completes Acquisition of Automation Engineering Inc (AEi)
February 8, 2022 | ASMPTEstimated reading time: 1 minute
ASM Pacific Technology Ltd. (ASMPT) announced that it has completed its all-cash acquisition of Automation Engineering, Inc. (AEi) from Mycronic Group on February 1, 2022, after satisfying all closing conditions set out in the acquisition agreement. The deal was first announced in September 2021.
Established in 1990 and based in Tewksbury, Massachusetts, USA, AEi is widely recognised as the de facto leader for the automotive camera active alignment market. The acquisition provides ASMPT not only a significant presence in the automotive camera assembly and test solutions space, but the ability to offer total solutions for automated and scalable end-to-end camera module assembly to a significantly global, expanded served market. It will also enable the pursuit of new adjacent market opportunities in security surveillance, drones and LiDAR, which will greatly expand the addressable market for such solutions.
The AEi team under General Manager Jean Marc Peallat will report to the business cluster under Mr. CK Lim, CEO of the ICD/ Discrete Business Unit, Semiconductor Solutions, ASMPT. The AEi team will be able to benefit from both ASMPT Group’s extensive global sales and order fulfilment networks (particularly in Asia), and ASMPT’s product development synergies such as total in-line systems that include integrating Industry 4.0 capabilities with powerful analytics and AI capabilities to augment product lines.
“We warmly welcome the AEi team into the ASMPT family,” said Mr. Robin Ng, Group CEO, ASMPT. “AEi’s automotive camera assembly and test solutions are widely adopted by Tier 1 automotive module suppliers, and offer other compelling opportunities for growth. This is consistent with our clear strategy of pursuing sustained, profitable growth via expansion into promising adjacent markets. I believe the addition of AEi to our broader portfolio of leading products, services, and solutions will in turn help support ASMPT’s long-term revenue and earnings growth.”
Share on:
Suggested Items
Flex Factory Recognized for Manufacturing Excellence and Continuous Improvement by the Association for Manufacturing Excellence
12/19/2024 | FlexFlex announced that its Zhuhai, China site, specializing in advanced assembly, tool design and manufacturing, and metal and plastics capabilities for Lifestyle and Data Center customers, received an Excellence Award from the Association for Manufacturing Excellence (AME) for demonstrating world-class continuous improvement and results. This is the third consecutive year a Flex facility received an AME Excellence Award.
Mycronic Introduces New Machine Models to Its High-Performance Pick-And-Place Platform MYPRO A40
12/06/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, is introducing two new machine models MYPro A40SX and A40LX to its next-generation MYPro A40 pick-and-place platform, equipped with the all-new MX7 high-speed mounthead technology.
IPC Announces Two New Courses to Enhance Electronics Manufacturing Excellence
12/03/2024 | IPCIPC is excited to announce the launch of two new courses designed to optimize electronics manufacturing processes: "Ensuring Excellence: IPC-J-STD-001 Process Optimization" and "Ensuring Excellence: IPC-A-610 Process Optimization."
Absolute EMS Enters Strategic Partnership with PTEC Solutions to Enhance End-to-End Electronics Manufacturing Capabilities
11/27/2024 | PTEC SolutionsAbsolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is excited to announce a new partnership with PTEC Solutions, a highly respected provider specializing in design, cable and mechanical assembly services.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.