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Indium Corporation to Present on e-Mobility at SMTA Dallas
February 8, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Dallas Expo & Tech Forum at 9:15 a.m. local time, Tuesday, March 22 in Dallas, Texas, U.S.
Today’s automotive landscape is changing at a breathtaking speed. Start-ups and legacy automotive makers alike are pouring billions of dollars into EVs. EVs have been called “computers on wheels” and for good reason, having more than three times the electronics and a fraction of the mechanical parts of an internal combustion engine. Unlike prior technologies that might have started in the U.S. only to later migrate offshore, EVs are an equal opportunity industry with thriving local manufacturing and a trend to source locally. In e-Mobility: Important Trends to Help Drive Your Business, O’Leary will explore some important trends in the market, such as commercial, technological, and supply chain. Participants should leave with key insights on how they might compete in this exciting and growing industry.
O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which include the markets for EVs, charging stations, and infrastructure among others. He joined Indium Corporation in 2014 and has more than 20 years of experience in sales, marketing, and channel management in the electronics industry. He earned his master’s degree in international management at the Thunderbird School of Global Management at Arizona State University, Phoenix, Ariz. He also co-authored two books on thermal profiling: Profiling Guide for Profitability and Profiling Guide for Six Sigma.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Advancing Photonic Soldering
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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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