-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
EMA Launches Spot the Differences Contest
February 24, 2022 | EMA Design AutomationEstimated reading time: Less than a minute
EMA Design Automation® (www.ema-eda.com), a full-service provider and innovator of Electronic Design Automation (EDA) solutions, is launching a Spot the Differences Contest in Honor of National Engineer’s Week.
This contest highlights some of the challenges associated with team collaboration including identifying and communicating changes between design revisions. The design compare functionality available in OrCAD for Teams automatically identifies and reports changes made between schematic revisions, saving engineers vital design time.
To enter, participants must find and identify 10 differences between two schematics for a chance to will $100.00 Amazon gift card. The contest will be available for submissions until February 28, 2022, with winners announced on March 1, 2022.
For more information on the contest visit www.ema-eda.com/2022-spot-the-differences.
Suggested Items
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Avnet Insights: Engineers Outline Opportunity for AI
12/19/2024 | AvnetFor the fourth consecutive year, Avnet, Inc. (Nasdaq: AVT) will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to the market since 2021. This year’s survey examines technology’s new frontier: Artificial Intelligence, and the promise – and challenges – it presents for product design.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.