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Benchmark Invests in New Photonics Packaging and Integration Capabilities
March 3, 2022 | Benchmark Electronics Inc.Estimated reading time: 1 minute
Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced it has invested in new optical integration, photonics packaging, and photonics test capabilities at its RF and Photonics Center of Innovation in Phoenix. The expanded capabilities allow Benchmark to support customers in cutting-edge applications such as high-speed digital communications, high performance computing, sensors, and laser systems. Benchmark's photonics team works alongside industry innovators to develop reliable, repeatable manufacturing processes for their pioneering designs.
"Our investments in state-of-the-industry photonics and optical integration capabilities in the United States allow Benchmark to build a leading market position in photonics, fiber optics, and free-space optics for next-generation computing and communication systems," said Jan Janick, Chief Technology Officer, Benchmark. "The photonics and optical integration capabilities are synergistic to our RF and microwave design and manufacturing capabilities already being delivered to customers through our Center of Innovation in Phoenix."
In addition to photonics engineers and technicians experienced in process development and improvement, the lab offers the latest alignment and fusion splicing technologies. Test and measurement platforms enable both process development and production, including tunable lasers, polarization synthesizers, and optical power meters to measure bit error rate test (BERT), polarization-dependent loss (PDL), and return loss (RL) of passive optical components. These platforms will be used across the design, development, and manufacturing workflow to verify the performance of complex light-based communications systems and conduct comprehensive characterizations of optical components, network elements, and optical fiber networks.
Benchmark currently provides photonics services for several leading-edge defense and high-performance computing customers that are instrumental in shaping the company's photonics technology roadmap. As a result, Benchmark can provide engineering and manufacturing services and test solutions to a diverse range of customers with highly complex photonics and optical technology applications.
Benchmark will be discussing its new photonics capabilities at the Optical Fiber Communication Conference® (OFC) from March 8 to 10, 2022. The company is hosting meeting room #2005 on the show floor.
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MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.
Podcast Hits the Mark in a Materials Market
04/15/2026 | Marcy LaRont, I-Connect007The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.
Inside Eastek Malaysia: Scalable Manufacturing Built on Trust, Stability, and Technical Expertise
04/14/2026 | Eastek International CorporationEastek International Corporation continues to strengthen its global manufacturing platform through the sustained performance and expanding capabilities of its Malaysia operation.
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.