Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
American Standard Circuits to Exhibit at Midwest Aerospace Conference 2022
March 3, 2022 | American Standard CircuitsEstimated reading time: 1 minute
Anaya Vardya, president and CEO of American Standard Circuits, announced recently that his company will be exhibiting at this year’s Midwest Aerospace Conference 2022, held March 10, at the Embassy Suites by Hilton, Rockford Riverfront, Rockford Illinois.
This year American Standard Circuits is a Supporting Sponsor of this event, and will be in Booth 8. “This is a great local show for us at ASC,” Vardya says. “We love that this is a local show which makes it easy for our team to go there and meet our local customers as well as potential new customers. Because we are focused on growing our aerospace business this year, this show is the right place for us to exhibit.”
The Midwest Aerospace Conference is continuing to strengthen supply chains, create connections, and share relevant information key to the aerospace industry through this event by featuring workshops, matchmaking, exhibitions, and presentations talking key topics in the aerospace industry from cybersecurity to supply chain development.
- The Printed Circuit Designer’s Guide to…?Fundamentals of RF/Microwave PCBs by John Bushie and Anaya Vardya (a free eBook available for download)
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentalsby Anaya Vardya and Dave Lackey (a free eBook available for download)
- The Printed Circuit Designer’s Guide to… Thermal Management by Anaya Vardya (a free eBook available for download)
- RealTime with… American Standard Circuits, three discussions: flex and rigid flex PCBs by Anaya Vardya and Dave Lackey; RF/microwave PCBS by Anaya Vardya and John Bushie; and thermal management by Anaya Vardya, John Bushie, and Dave Lackey
- You can also view other titles in our full I-007e Book library here.
Share on:
Suggested Items
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.
GKN Aerospace Delivers First High Voltage EWIS System for Clean Aviation’s SWITCH Project
06/16/2025 | GKN AerospaceGKN Aerospace has completed and delivered the first high voltage Electrical Wiring Interconnection System (EWIS) for the Clean Aviation SWITCH project.
RTX's Collins Aerospace Expands Aircraft Electrification Capabilities in Europe
06/12/2025 | RTXCollins Aerospace, an RTX business, expanded its aircraft electrification capabilities with the introduction of a new engineering center of excellence in Wolverhampton, UK, and a new electric thrust reverser actuation systems (elecTRAS) production line in Colomiers, France.