-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young, Repstronics Hosting Joint Webinar
March 9, 2022 | Koh YoungEstimated reading time: 2 minutes

In cooperation with its Mexico Sales Partner Repstronics, Koh Young, the industry leader in True3D measurement-based inspection solutions, is hosting a FREE Spanish webinar to help customers create smarter factories with AI-powered inspection solutions. The online seminar will begin at 1:00PM EST on Wednesday, 23 March 2022. Given the expected attendance for this trending topic, pre-registration for the free webinar is required.
Description automatically generated “Right now, inspection plays an increasingly key role in making manufacturing smarter. Inspection allows us to deliver the quality we know is essential for the products being manufactured right now, and in the future,” commented Brent Fischthal, Senior Marketing Manager at Koh Young America. “It is providing the data that allow companies to improve their own performance and efficiency. Data from inspection is contributing to almost every process on the SMT line, supplying real insight into defects, as well as their root cause.”
An industry dynamic changing the SMT line—and the whole manufacturing world—is the use of data to manage the process and drive towards a smart factory. This trend has helped manufacturers connect equipment and processes, so they can integrate the inspection data from solder paste inspection (SPI) and automated optical inspection (AOI) to improve electronics production metrics. Tools such as Artificial Intelligence (AI) and Machine Learning (ML) are used to analyze large data streams and produce better, faster decision-making that augments the operator by offering a path to autonomous manufacturing where the line will self-manage and improve its own performance. For companies to succeed in the development of a smart factory, manufacturers will need inspection solutions and equipment partners who can combine inspection and measurement expertise with machine-to-machine connectivity and AI.
“Reliable inspection systems have become powerful, economical complements to traditional test strategies. For example, SPI and AOI machines can be connected to the printer and mounter to monitor and improve the SMT production line,” stated Ramon Hernandez, Country Manager for Mexico and South America. “During this webinar, I will explore how manufacturers can optimize the PCBA [printed circuit board assembly] process by exchanging real-time SPI and AOI measurement data with other machines in the production line.”
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal (a free eBook available for download)
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e Book library here
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.