-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TRI Launches New Bottom-view 3D AOI
March 9, 2022 | TRIEstimated reading time: Less than a minute

Test Research, Inc. (TRI) announces the launch of the 3D high-speed bottom-view AOI solution, TR7700QB SII, performing at industry-leading speeds of up to 57 cm2/sec.
The TR7700QB SII is built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The TR7700QB SII is the bottom-view 3D AOI solution with 15 µm high resolution 12 MP imaging capable of metrology-grade inspection.
Designed for high-coverage bottom-view inspection, the TR7700QB SII offers defect detection for Through-hole technology (THT) components and dual in-line packages. The smart-factory-ready solution is capable of data exchange and eases MES connectivity.
Suggested Items
Nokia, Honeywell Aerospace Technologies Partner with Numana to Advance Quantum-safe Networks
04/01/2025 | HoneywellNokia and Honeywell Aerospace Technologies announced a strategic partnership with Numana to advance Quantum-Safe Networks (QSN) in Montreal, Canada, and worldwide.
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
04/01/2025 | JCN NewswireThe European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB
04/01/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.
Incap Launches ‘Incap Legends’ esports Tournament and Invites Students from Around the World to Participate
03/31/2025 | IncapIncap Corporation is proud to announce the launch of ‘Incap Legends’, a new esports tournament in partnership with Newcastle and Stafford Colleges Group (NSCG).
Foxconn Chairman Young Liu to Deliver Keynote at COMPUTEX 2025
03/28/2025 | PRNewswireTAITRA (Taiwan External Trade Development Council), announced that Young Liu, Chairman of Hon Hai Technology Group (Foxconn), is invited to be the speaker at COMPUTEX 2025 Keynote, sharing his vision on three intelligent platforms driving industry transformation and the role of robotics in factories of the future.