Test Research, Inc. (TRI) announces the launch of the 3D high-speed bottom-view AOI solution, TR7700QB SII, performing at industry-leading speeds of up to 57 cm2/sec.
The TR7700QB SII is built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The TR7700QB SII is the bottom-view 3D AOI solution with 15 µm high resolution 12 MP imaging capable of metrology-grade inspection.
Designed for high-coverage bottom-view inspection, the TR7700QB SII offers defect detection for Through-hole technology (THT) components and dual in-line packages. The smart-factory-ready solution is capable of data exchange and eases MES connectivity.