Indium Corporation to Feature Liquid Metal Thermal Solutions at SEMI-THERM

Estimated reading time: 1 minute

Indium Corporation will feature products from its line of proven gallium-based liquid metal thermal solutions at SEMI-THERM, March 21-25, San Jose, California, U.S.

Indium Corporation is a leader in high-performance liquid metal-based thermal interface materials (TIM) with advanced knowledge and experience in high-volume TIM0, TIM1, and TIM2 applications.

Indium Corporation’s Gallitherm™ portfolio of gallium-based liquid metal solutions draws on the company’s more than 60 years of experience in manufacturing gallium-based liquid metals. Indium Corporation also offers significant global technical support to help customers ensure their liquid metal thermal solutions meets their application needs with low- and high-volume production available in the U.S. and Asia.

Indium Corporation offers a number of innovative high-performance metal TIM solutions. With its portfolio of alloys that are liquid at or near room temperature, Indium Corporation's liquid metal TIMs are designed to offer superior thermal conductivity for both TIM1 and TIM2 applications. Liquid metal TIMs offer: 

• High thermal conductivity, enhancing end-product longevity and reliability
• Low interfacial resistance against most surfaces, ensuring they dissipate heat quickly
• Extraordinary wetting ability to both metallic and non-metallic surfaces
• Liquid metal TIMs are available in a variety of alloys, including InGa and InGaSn.

Indium Corporation’s m2TIMTM combines liquid metal with a solid metal preform to provide reliable thermal conductivity for heat dissipation without the need for a solderable surface. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.

Available in InGa and InGaSn, this m2TIMTM hybrid approach provides extraordinary wetting ability to both metallic and non-metallic surfaces and low interfacial resistance. It also eliminates the risk of pump-out of the liquid alloy.

For more information, visit Indium Corporation’s experts at the show at booth #500.

Download The Printed Circuit Assembler’s Guide to… Solder Defectsby Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.