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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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Averatek Opens New Channels for Mina Surface Treatment
March 11, 2022 | AveratekEstimated reading time: 1 minute
Averatek is pleased to announce the addition of Jeff Berlin of TEC Associates to its marketing efforts. As a manufacturer's representative, Berlin will be responsible for business development with Mina, a surface treatment that enables soldering to aluminum. Replacing silver-based ACP (Anisotropic Conducting Paste) with solder, Mina offers more cost-effective and environmentally friendly manufacturing, with shorter processing times and reduced wet-chemistry steps.
“Mina™ lifts the constraints of traditional processes and opens a range of new applications – notably in the RFID, LED and automotive industries,” says Tara Dunn, Averatek Vice President of Marketing and Business Development “Helping business partners to realize the full benefits of this technology is a great fit for Jeff, with his years of industry experience.”
Soldering to aluminum traditionally requires an additional surface finish, such as Zincate and ENIG – or the use of conductive epoxy. These are cost-prohibitive and carry reliability challenges. Additionally, existing solders, fluxes and cleaners are formulated for copper-based PCBs and do not work well on aluminum.
“The culture of innovation at Averatek is energizing, and it is exciting to bring a breakthrough technology like Mina™ to the market,” says Jeff Berlin, TEC Associates Sales Representative. “Mina™ is a great addition to our line-up of quality products and a unique option for our customers.”
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Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.