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Hentec/RPS to Exhibit at SMTA Dallas Expo & Tech Forum
March 15, 2022 | Hentec Industries/RPS AutomationEstimated reading time: 1 minute
Hentec Industries/RPS Automation announces that it will exhibit its full line of selective soldering, component lead tinning and solderability test equipment at the upcoming SMTA Dallas Expo & Tech Forum to be held at the Plano Event Center, in Plano, Texas on March 22, 2022.
At the SMTA event, Tom Baro, National Sales Manager for Hentec/RPS will be on-site to discuss how Hentec/RPS selective soldering, component lead tinning and solderability test equipment can improve the production quality of your printed circuit board assembly operation. The Vector and Valence selective soldering systems feature unlimited program storage, integrated system software, witness camera and auto fiducial correction. Available in either standalone or SMEMA in-line configurations, the Vector and Valence are offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles. All Vector and Valence systems are UL and CE certified and carry both a two-year system warranty and a four-year solder pot warranty.
Hentec/RPS Odyssey robotic hot solder dip machines are MIL spec complaint component lead tinning machines designed for gold removal, re-tinning applications, including high reliability and military applications as well as BGA de-balling. The Pulsar solderability test system features a dip-and-look qualitative test method to verify the solderability of the surface of electronic components and can be easily performed by shop floor personnel with minimal training.
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.