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KYZEN to Discuss Unmatched Automated Process Management for Cleaning at the SMTA Boise Expo
March 15, 2022 | KYZEN'Estimated reading time: 1 minute

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Boise Expo & Tech Forum, scheduled to take place Tuesday, April 5, 2022 at The Grove Hotel in Idaho. The company will discuss its new AQUANOX® A4626 Next Generation Aqueous Cleaning Solution and Process Care Line.
KYZEN will highlight its Process Care Line, designed to offer unmatched automated process management and control with remote reporting capabilities. These abilities enable customers to deliver higher quality output with less effort all while monitoring processes even when no one is on the production floor.
Additionally, the KYZEN team will discuss the newest addition to the AQUANOX line – the A4626 next-generation cleaning chemistry designed to quickly remove the latest polymeric no-clean flux residues. A4626 provides superior results on traditional lead-free and eutectic tin-lead residues. It has a long tank life and is safe for multi-pass applications.
KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analyst paired with KYZEN Analyst Data Services will complete the optimization and provide you with a worry-free process.
The KYZEN team looks forward to meeting with attendees to offer solutions tailored to their specific needs.
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07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
Tightening of LPDDR4X Supply Drives Up Prices; Smartphone Brands to Accelerate Adoption of LPDDR5X
07/17/2025 | TrendForceTrendForce’s latest investigations reveal that major Korean and U.S. memory suppliers are expected to significantly reduce or even cease production of LPDDR4X in 2025 and 2026.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.