Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Learn More about KYZEN’s New Aqueous Cleaning Solution at Two SMTA Expos in April
March 18, 2022 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at both the SMTA Atlanta and Huntsville Expos in April to discuss its new AQUANOX A4626 Next Generation Aqueous Cleaning Solution. The SMTA Huntsville Expo will take place Tuesday, April 12, 2022 at The Jackson Center in Alabama. The SMTA Atlanta Expo will take place Wednesday, April 20, 2022 at the Atlanta Tech Park in Georgia.
AQUANOX A4626 is the newest addition to the award-winning AQUANOX product line. In fact, A4626 already won a 2022 NPI Award shortly after its introduction. The environmentally friendly AQUANOX A4626 removes all of the latest as well as traditional flux residues.
AQUANOX A4626 is a next generation cleaning chemistry designed to quickly remove the latest polymeric no-clean flux residues, while providing superior results on traditional lead-free and eutectic tin-lead residues as well. It has a long tank life and is safe for multi-pass applications.
KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analyst paired with KYZEN Analyst Data Services will complete the optimization and provide you with a worry-free process.
Share on:
Suggested Items
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
07/08/2025 | Mike Konrad -- Column: The Knowledge BaseIn electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
Smarter Machines Use AOI to Transform PCB Inspections
06/30/2025 | Marcy LaRont, PCB007 MagazineAs automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.