-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Gen3 Provides Key Tools for Electric Vehicles
March 23, 2022 | Gen3Estimated reading time: 1 minute
UK Manufacturer of test and measurement equipment for the electronics industry, Gen3 is working overtime to produce enough of its systems to meet the rapidly growing demand for both their AutoSIR2+ and AutoCAF2+ Systems.
The explosion in electric vehicles has seen massive increases in the electronic drive train that has put significant stresses on circuit boards. Failure by CAF and other high voltage mechanisms are now of key concern. The AutoCAF is the perfect instrument to characterise and provide objective evidence validating key electronic material choices.
Gen3 have been globally testing and measuring the electronics industry for over 40 years. With a reputation for precision in excellence, they have become the ‘go-to’ company for all sizes of Original Electronic Makers (OEMs) to ensure perfection in performance and reliability.
Customer demand for their AutoCAF2+ system has seen a year’s worth of orders placed over a 4-month period, and this is only to increase as the year progresses. Our newly expanding team have been successful in meeting this sudden upsurge in demand.
Andy Naisbitt, CEO of Gen3 commented “We continue to work alongside our customers in ensuring their products meet the standards that the industry sets. We are pleased that our system is selected and have been acknowledged as the ‘go to’ system Worldwide.”
CAF, or sub-surface electro-chemical migration, is a serious challenge in the development and design of printed circuit boards especially in the newly evolving e-mobility market. Early detection of possible CAF formation during the development of printed circuit boards can minimize safety risks and reduce the cost of failures in service.
CAF testing for Electric Vehicle technology is now running at up to 4000V for over 4000 hours.
- The Printed Circuit Assembler’s Guide to… Process Validation by Graham K. Naisbitt (a free eBook available for download)
- “Predicting Reliability in Electronics,” a free 12-part webinar series with experts Graham Naisbitt and Chris Hunt
- Roundtable Discussion: Process Ionic Contamination Test (PCT) Standard Roundtable with Industry Experts, including Graham Naisbitt of Gen3, Teresa Rowe of IPC, Jason Keeping of Celestica, and Doug Pauls of Collins Aerospace
- You can also view other titles in our full I-007e Book library here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.