Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Spirit Electronics Adds MIL-STD-883 Test Services with DLA Commercial Lab Suitability
March 23, 2022 | Business WireEstimated reading time: 1 minute
Spirit Electronics, a value-added microelectronics distributor, announced the achievement of DLA Commercial Lab Suitability for MIL-STD-883. Spirit’s qualified test methods include external visual inspection, temperature cycling, HAST (biased and unbiased), stabilization bake and scanning acoustic microscopy.
The Commercial Lab Suitability program is run by the Defense Logistics Agency (DLA) Land and Maritime Sourcing and Qualifications Division. The program goal is to qualify labs in the defense supply chain capable of performing testing to military specifications. Qualified commercial labs complete an application process and multi-day site audit of their test methods and quality management system.
“Our lab services are part of our new distribution, test and assembly approach to delivering components ready-to-use to our customers,” says Spirit CEO Marti McCurdy. “At the end of the day, these tests are your mission insurance, and DLA lab suitability ensures we’re meeting the high-reliability requirements of the military standards.”
Spirit Electronics’ suitability allows the company to perform specific test methods for microelectronics covered by MIL-STD-883: 1008 Stabilization Bake (Conditions A–D), 1010 Temperature Cycling (Conditions A–E), 2009 External Visual, 2030 Ultrasonic Inspection of Die Attach, JESD22-A110 HAST, and JESD22-A118 Unbiased HAST. These processes can be performed together to create custom test flows to condition and inspect microcircuits for space and other harsh environments.
Temperature cycling, HAST and stabilization bake are used to stress microelectronics, particularly plastic-packaged microcircuits (PEMs), with heat, humidity and temperature extremes. Methods such as sonic acoustic microscopy are then used to inspect the integrity of the component package.
This is Spirit Electronics’ second DLA qualification. Spirit was added to the DLA’s Qualified Suppliers List of Distributors for microcircuits and semiconductors in 2019. The two qualifications support Spirit’s unique position as both a distributor and a test lab.
While working toward lab suitability, Spirit Electronics added a circuit card assembly line, XRF analysis and precision laser marking in 2021. New services this year include robotic solder reballing.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.