-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Spirit Electronics Adds MIL-STD-883 Test Services with DLA Commercial Lab Suitability
March 23, 2022 | Business WireEstimated reading time: 1 minute
Spirit Electronics, a value-added microelectronics distributor, announced the achievement of DLA Commercial Lab Suitability for MIL-STD-883. Spirit’s qualified test methods include external visual inspection, temperature cycling, HAST (biased and unbiased), stabilization bake and scanning acoustic microscopy.
The Commercial Lab Suitability program is run by the Defense Logistics Agency (DLA) Land and Maritime Sourcing and Qualifications Division. The program goal is to qualify labs in the defense supply chain capable of performing testing to military specifications. Qualified commercial labs complete an application process and multi-day site audit of their test methods and quality management system.
“Our lab services are part of our new distribution, test and assembly approach to delivering components ready-to-use to our customers,” says Spirit CEO Marti McCurdy. “At the end of the day, these tests are your mission insurance, and DLA lab suitability ensures we’re meeting the high-reliability requirements of the military standards.”
Spirit Electronics’ suitability allows the company to perform specific test methods for microelectronics covered by MIL-STD-883: 1008 Stabilization Bake (Conditions A–D), 1010 Temperature Cycling (Conditions A–E), 2009 External Visual, 2030 Ultrasonic Inspection of Die Attach, JESD22-A110 HAST, and JESD22-A118 Unbiased HAST. These processes can be performed together to create custom test flows to condition and inspect microcircuits for space and other harsh environments.
Temperature cycling, HAST and stabilization bake are used to stress microelectronics, particularly plastic-packaged microcircuits (PEMs), with heat, humidity and temperature extremes. Methods such as sonic acoustic microscopy are then used to inspect the integrity of the component package.
This is Spirit Electronics’ second DLA qualification. Spirit was added to the DLA’s Qualified Suppliers List of Distributors for microcircuits and semiconductors in 2019. The two qualifications support Spirit’s unique position as both a distributor and a test lab.
While working toward lab suitability, Spirit Electronics added a circuit card assembly line, XRF analysis and precision laser marking in 2021. New services this year include robotic solder reballing.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.