Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Season Group Receives Caring Company Logos For The Second Time
March 24, 2022 | Season GroupEstimated reading time: 1 minute
Season Group, an international electronics design, manufacturing, and supply chain solutions provider, is glad to report that its two Hong Kong-based subsidiaries, Season Component Co Ltd. and SG Wireless Ltd., have been awarded the Caring Company Logo for the second time by the Hong Kong Council of Social Service (HKCSS). Receiving the award in consecutive years has been an achievement Season Group is proud to celebrate.
The Caring Company Scheme launched by HKCSS in 2002 encourages companies to increase their social engagement with local charities and to better their care for the environment and employees. Recognition is given to companies that have such an altruistic culture through the award of a Caring Company Logo.
Having first received the Caring Company Logo in 2021, Season Group has been striving to nurture a warm and caring company culture that benefits not only our local communities and the environment but also our employees stationed in global sites. Last year, a running club was created to promote regular exercise amongst employees, and several social events planning groups were established globally to improve the work-life balance at Season Group. Certain charitable efforts of Season Group, such as annually raising funds and awareness for breast cancer and men’s health, also stem from previous related afflictions of employees.
Such a caring mindset is similarly reflected in the work of Season Group. In 2021, Season Group has been the manufacturing and/or design engineering partner for elderly care, disability care, hospitals, and anti-epidemic related products, to list a few examples. Season Group aims to support even more creations of impactful and meaningful electronics in 2022.
Season Group would like to thank the HKSKH Lady MacLehose Centre for our Caring Company award nomination, and for enabling Season Group to give back to the Hong Kong community through the Centre’s non-profit efforts.
In response to our receipt of the Caring Company Logo, CEO Carl Hung stated, “We are very honored to be recognized as a caring company by HKCSS once again. The recognition motivates us to take even better care of our employees, the environment and our local communities. Season Group is committed to our mission of improving the world’s living standards and our vision of ensuring that employees love what they do. We look forward to making a sustained positive impact to our people and our surroundings, and giving back more to our society.”
Share on:
Suggested Items
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
2024 Stromberg Student Leader Scholarship Recipient Announced
11/05/2024 | SMTASMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.
Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.