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Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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Helping the World Build Electronics Better
March 28, 2022 | IPCEstimated reading time: 1 minute
Hundreds of experts from around the world will discuss electronics manufacturing standards in more than 80 standards meetings May 7–12, at IPC SummerCom 2022 in Milwaukee, Wisconsin.
Facilitated by representatives from OEMs, PCB manufacturers, EMS providers, design firms, and other organizations, IPC standards development committees establish benchmarks for excellence in electronics manufacturing.
According to David Bergman, IPC vice president of standards and technology, industry standards enable companies to negotiate commerce and they contribute directly to the success of the industry as a whole.
“IPC’s internationally recognized standards cover nearly every stage of the electronics product development cycle,” Bergman said. “Through standards committee meetings, everyone in the industry can engage in an exchange of ideas about current industry trends as well as the identification of new standards and updating of current ones. IPC standards help our member companies ensure superior quality, reliability and consistency in electronics manufacturing.”
Standards development committee meetings will cover industry benchmarks in assembly and joining; assembly equipment, base materials; cleaning and coating; electronic documentation technology; electronic product data description; embedded devices; environment, health and safety; fabrication processes; flexible and rigid-flex printed boards; high speed/high-frequency interconnection; management; packaged electronics components; printed board design, printed electronics; process control; product assurance; product reliability; rigid printed boards; terms and definitions; testing; and wearable electronics/e-textiles.
This year, IPC SummerCom will be co-located with the Electrical Wire Processing Technology Expo (EWPTE) at the Wisconsin Center. IPC SummerCom registration gives participants free access to EWPTE. For more information on standards development activities at IPC SummerCom or to register, visit ipc.org/event/ipc-summercom.
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