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East/West Expands with Hanwha Automation for High-Quality PCB Assembly
March 31, 2022 | East/West Manufacturing EnterprisesEstimated reading time: 1 minute
Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, announces that it has partnered with East/West Manufacturing Enterprises (East/West) to increase high-quality PCB assembly in its manufacturing facility.
East/West is a full-service electronic contract manufacturing company that produces high-quality PCBs, custom cables, and electrical/mechanical assemblies for many different industries globally. Headquartered in Round Rock, TX, the company provides industry-leading electronics manufacturing services and optimized supply chain solutions for customers in a range of industries including industrial and commercial OEMs, medical, automotive, and military-related device manufacturers.
East/West recently purchased a line solution from Hanwha Techwin for its new expanded facility. Andy Salo, East/West President & CEO, said, “We were moving into our new state-of-the-art 43,000 sq ft facility and needed to add a new SMT line to increase capacity. We looked at several SMT equipment vendor solutions, and chose multiple Hanwha Techwin Decan S1s for pick-and-place. Hanwha offered a very compelling solution for versatility, speed, and overall features including Aegis FactoryLogix NPI integration, offline programming and feeder verification. In fact, Hanwha provided a turnkey full line solution including an advanced Pemtron 3D SPI for solder paste inspection and a TSM Nitrogen Reflow Oven. We couldn’t be happier with the speed and overall capabilities of the new Hanwha SMT line.”
Jonny Nichols, Vice President of Marketing at Hanwha Techwin, added, “Congratulations to Andy Salo and team on their new facility and selection of advanced machinery for PCB assembly from Hanwha Techwin Automation Americas. The future of electronic manufacturing is certainly bright in the state of Texas as is the newly forged partnership between East/West and HTAA.”
With the highest performance among mounters in its class, the Decan S1 next-generation chip mounter accommodates both standard and large PCBs, providing optimal productivity for batch production, while improving actual productivity and placement quality and reducing loss rates. With a placement speed of 47,000 cph and accuracy of ±28 µm, the Decan S1 improves placement speeds of odd-shaped components by 25 percent. Additionally, the system improves simultaneous pick-up rates by arranging pocket positions automatically through communication between the machine and feeder.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.