Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
TRI launches New High Throughput ICT
March 31, 2022 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI) proudly announces the launch of the high-density pin count In-Circuit Tester (ICT) TR8100H SII with vacuum fixture for full coverage testing.
The TR8100H SII is the latest high-performance board test system targeting the low-voltage testing market, as well as for large and complex PCBAs.
TR8100H SII's vacuum fixture system ensures full pin contact, and with up to 11,088 pins digital MUX-free architecture, the system allows for faster and simpler testing of large pin-count devices and fast program development. The ICT has built-in auto-calibration and self-diagnostics to ensure long-term testing reliability.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Analog Devices Launches ADI Power Studio™ and New Web-Based Tools
10/14/2025 | Analog Devices, Inc.Analog Devices, Inc., a global semiconductor leader, announced the launch of ADI Power Studio, a comprehensive family of products that offers advanced modeling, component recommendations and efficiency analysis with simulation. In addition, ADI is introducing early versions of two new web-based tools with a modernized user experience under the Power Studio umbrella:
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Bluepath Robotics Optimizes AMR Fleets with Inductive Charging Solution from Wiferion
10/09/2025 | WiferionIn a dynamic and highly competitive industry such as logistics, efficient and uninterrupted material flows are of crucial importance. To ensure maximum uptime for its robots, Bluepath Robotics, which specializes in autonomous mobile robots (AMR), needed a reliable and powerful power supply.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q2 2025
10/06/2025 | SEMIElectronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the $4,685.5 million registered in the second quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.