Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
MacDermid Alpha Electronics Solutions to Feature New Low Temperature Solder Paste at SMTA Huntsville Expo & Tech Forum
April 1, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 12 at The Jackson Center.
MacDermid Alpha will feature the recently launched ALPHA OM-565 HRL3 low temperature solder paste. ALPHA OM-565 HRL3 is formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages. The ALPHA OM-565 chemistry enhances thermomechanical performance over existing low temperature solders, including excellent compatibility when used in combination with other tested assembly products, such as rework fluxes and cored solder wires.
“ALPHA OM-565 HRL3 alloy is our latest low temperature solder (LTS) paste and is an important addition to our LTS portfolio of solutions offering,” said Scott Lewin, Regional Marketing Manager. “Not only does it minimize post-reflow defects such as non-wet opens and head-in-pillow, but it also provides similar thermal cycling and drop shock performance to SAC305 at its target operating temperature range of -40 up to 85 °C. All this at a peak reflow temperature of only 175 °C! Because of this lower peak temperature requirement, ALPHA OM-565 also lowers overall energy consumption contributing to the industry’s efforts at increased sustainability.”
In addition, the high reliability solutions portfolio including ALPHA CVP-390V and Kester NP505-HR solder pastes with Innolot alloy and the ALPHA HiTech series of adhesive, edgebond, and underfill will be promoted. These materials are designed for a wide range of applications to provide exceptional performance in the harshest of environments.
Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007e Book library here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.