-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha Electronics Solutions to Feature New Low Temperature Solder Paste at SMTA Huntsville Expo & Tech Forum
April 1, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 12 at The Jackson Center.
MacDermid Alpha will feature the recently launched ALPHA OM-565 HRL3 low temperature solder paste. ALPHA OM-565 HRL3 is formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages. The ALPHA OM-565 chemistry enhances thermomechanical performance over existing low temperature solders, including excellent compatibility when used in combination with other tested assembly products, such as rework fluxes and cored solder wires.
“ALPHA OM-565 HRL3 alloy is our latest low temperature solder (LTS) paste and is an important addition to our LTS portfolio of solutions offering,” said Scott Lewin, Regional Marketing Manager. “Not only does it minimize post-reflow defects such as non-wet opens and head-in-pillow, but it also provides similar thermal cycling and drop shock performance to SAC305 at its target operating temperature range of -40 up to 85 °C. All this at a peak reflow temperature of only 175 °C! Because of this lower peak temperature requirement, ALPHA OM-565 also lowers overall energy consumption contributing to the industry’s efforts at increased sustainability.”
In addition, the high reliability solutions portfolio including ALPHA CVP-390V and Kester NP505-HR solder pastes with Innolot alloy and the ALPHA HiTech series of adhesive, edgebond, and underfill will be promoted. These materials are designed for a wide range of applications to provide exceptional performance in the harshest of environments.
Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007e Book library here.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.