Nolan’s Notes: Looking Deep Into the Future With X-ray
Knocking Down the Bone Pile: Basics of Component Lead Tinning
Standard of Excellence: Anticipating Customer Needs Early and Often
CyberOptics Features New Dual-Mode MRS Sensor at Smart SMT & PCB Assembly in Korea
April 4, 2022 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will feature the SQ3000 Multi-Function system for AOI, SPI and CMM and the SQ3000 + powered by Multi-Reflection Suppression (MRS) technology at the Smart SMT & PCB Assembly Show in booth #I132 , scheduled to take place April 6-8, 2022 at the Suwon Convention Center in Suwon, South Korea. The company also will highlight the SE3000 with the new dual-mode MRS sensor.
The SE3000™ SPI System incorporates the new Dual-Mode MRS sensor for superior performance and maximum flexibility for dedicated solder paste inspection applications, with one mode for high-speed, and another mode for high resolution. The new sensor is an extension of the proprietary sensor portfolio that provides industry-leading performance in semiconductor and SMT markets. Customers value the high accuracy, repeatability and reproducibility of the SE3000 that is ideal for detecting insufficient or excessive paste, height, area and other SPI applications.
“For dedicated SPI applications, we have integrated our new Dual-Mode MRS sensor into the SE3000 system to provide superior performance and flexibility,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “With this addition to our portfolio of systems, customers have another option that can significantly improve their yields, processes and productivity.”
The SQ3000™+ Multi-Function system powered by MRS for inspection and metrology is an extension of the multi-award-winning SQ3000 platform deemed best-in-class, that not only conducts AOI and SPI, but uniquely delivers in-line, full coordinate measurement (CMM) data in seconds, not hours.
CyberOptics’ unique MRS sensor architecture simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together, delivering metrology grade accuracy at production speed. Effective suppression of multiple reflections from shiny components and surfaces is critical for highly accurate inspection and metrology, making it an ideal technology solution for a wide range of applications with high quality requirements.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
04/03/2025 | Real Time with...IPC APEX EXPOMichael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.