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Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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Sixteen Indium Corporation Experts Certified by SMTA
April 4, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation is pleased to announce that 16 employees have earned SMTA certification as part of its ongoing mission to invest in its technical talent to ensure customer success through professional development.
These team members join several of their colleagues around the globe as Certified SMT Process Engineers (CSMTPEs):
- Timothy Raner, research associate
- Ryan Mayberry, technical support engineer
- Dr. Casey Rowland, research chemist
- Dr. Jay Decker, research chemist
- Jenny Gallery, product specialist
- Dr. Mohan Gamage, research chemist
- Tyler Hutchinson, senior product specialist
- Brian Rundell, technical support engineer
- Tyler Richmond, research associate
- Joseph Hertline, product manager – ESM/power electronics
- Elaina Montague, research chemist
- Matthew Gruber, technical support engineer
- John Swick, technical sales engineer – automotive
- Dr. Arnab Dasgupta, research technologist
- Claire Hotvedt, product development specialist
- Dr. Hyoryoon Jo, research chemist
SMTA's CSMTPE Certification is a unique program that is sponsored by the Surface Mount Technology Association (SMTA), which recognizes and certifies competence across the entire SMT assembly process at an engineering level. This certification is one of the electronics assembly industry's most respected validations of process excellence.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
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Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.