-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Electronic System Design Industry Logs 14.4% YoY Revenue Growth in Q4 2021
April 4, 2022 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 14.4% from $3,031.5 million in Q4 2020 to $3,468.2 million in Q4 2021, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 15.8%.
“The industry continued to report double-digit year-over-year revenue growth for Q4 2021 and ended 2021 with $13.2 billion total market revenue,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories Computer-Aided Engineering, Printed Circuit Board and Multi-Chip Module, Semiconductor Intellectual Property, and Services recorded double-digit growth for the quarter. Geographically, the Americas; Europe, Middle East, and Africa (EMEA); and Asia Pacific (APAC) all reported revenue growth.”
The companies tracked in the EDMD report employed 51,236 people globally in Q4 2021, a 5.7% increase over the Q4 2020 headcount of 48,478 and up 0.1% compared to Q3 2021.
The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.
Revenue by Product and Application Category – Year-Over-Year Change
- Computer-Aided Engineering (CAE) revenue increased 11.2% to $1,064.6 million. The four-quarter CAE moving average increased 12.2%.
- IC Physical Design and Verification revenue decreased 2% to $624.5 million. The four-quarter moving average for the category rose 7%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 13.9% to $333.7 million. The four-quarter moving average for PCB and MCM rose 15.1%.
- Semiconductor Intellectual Property (SIP) revenue jumped 24.8% to $1,314.3 million. The four-quarter SIP moving average grew 23.9%.
- Services revenue increased 43.1% to $131.1 million. The four-quarter Services moving average increased 19%.
Revenue by Region – Year-Over-Year Change
The Americas, the largest reporting region by revenue, procured $1,577.2 million of electronic system design products and services in Q4 2021, a 21% increase. The four-quarter moving average for the Americas rose 17.2%.
Europe, Middle East, and Africa (EMEA) procured $482.5 million of electronic system design products and services in Q4 2021, a 5.5% increase. The four-quarter moving average for EMEA grew 12.6%.
Japan’s procurement of electronic system design products and services decreased 2.4% to $222.8 million. The four-quarter moving average for Japan rose 1%.
Asia Pacific (APAC) procured $1,185.6 million of electronic system design products and services in Q4 2021, a 13.8% increase. The four-quarter moving average for APAC increased 18.9%.
Suggested Items
Sondrel Awarded New Video Processor ASIC Design and Supply Contract
05/09/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to announce that it has won a major ASIC design and supply contract for a next generation, video processing chip.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.