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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Tower Semiconductor, Semtech Expand SiGe Partnership for Data Centers

10/23/2026 | Tower Semiconductor
Tower Semiconductor, the leading foundry for high-value analog semiconductor solutions, and Semtech Corporation, a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (IoT) devices worldwide, announced an expanded multi-year agreement that builds on the companies’ 20-year partnership.

SEHO Introduces SelectLine-S: German Engineering for the Asian Electronics Market

10/22/2026 | SEHO Systems GmbH
SEHO Systems GmbH will introduce the SelectLine-S, a new selective soldering machine, at NEPCON Shenzhen 2026, taking place October 27–29 in Shenzhen, China.

Building Consistent Reflow Results Across Automotive Manufacturing Sites

10/20/2026 | Miles Moreau, KIC
As automotive electronics production shifts among global locations, replicating a successful assembly process isn’t as simple as moving the equipment or copying a recipe. Miles Moreau of KIC talks with Nolan Johnson about the challenges of maintaining consistent reflow performance across different lines and facilities. They explore what manufacturers can learn from better process data, where optimization can make a difference, and why experienced engineers still play a critical role in getting the process right.

Vietjet Air Expands Contract with RTX’s Collins Aerospace

10/12/2026 | Collins Aerospace
Collins Aerospace, an RTX business, has expanded its contract with Vietjet Air to include FlightSense™, which provides technical and maintenance solutions for the airline’s additional 44 GTF-powered Airbus A320neo family aircraft.

United Electronics Corporation Installs New Automated Pumice Surface Preparation Line

10/08/2026 | United Electronics Corporation
New Circuit Tech International Pumice Line and 50-Panel Unloader Deliver Consistently Prepared Copper for Stronger Solder Mask Adhesion
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