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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Yamaha’s YRi-V Offers Fastest 3D AOI on the Market Today
April 7, 2022 | Yamaha Motor IMEstimated reading time: 1 minute
Yamaha Motor Intelligent Machinery (IM) offers the fastest 3D automated optical inspection on the market today in the YRi-V hybrid 3D multi-purpose AOI system. Designed to serve all markets that require ultra-high-speed and precision 3D inspections, YRi-V systems feature mounted coaxial lighting and 12um, 7um, 5?m lense options that support high accuracy and high-speed performance.
The YRi-V can achieve 56.8cm2/sec. inspection speeds under optimum conditions, with accuracy ensured by its 8-way projectors and 4-way oblique imaging through its 20 Megapixel angle cameras. Lens/coaxial lighting options ensure very high resolution, well-suited to device inspection. Notable features include the following:
- New 5um resolution for narrow pitch 0201mm devices;
- New co-axial lighting system for finding defects in reflective surfaces;
- New camera and projector system that offers improved inspection capability;
- New AI supported easy programming and job creation;
- New unified YR platform machine interface.
Most notably, YRi-V can convey large PCBs, with L610mm and W610mm dimensions as a standard. The dual-lane system can convey large PCBs with W320mm on the two lanes. Additionally, the newly-developed Dual Lane system can operate dynamically with 1 fixed and 3 moving rails. The system can be easily connected to upstream and downstream equipment; this contributes to establishing dual lane flexibility.
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SIA Statement on Biden Administration’s Launch of Section 301 Trade Investigation Related to China’s Targeting of the Semiconductor Industry for Dominance
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.