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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 8, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Spring has definitely sprung, and the trade show season continues to roll right along. Managing Editor Nolan Johnson just returned from DesignCon 2022, and as he says in his review, the attendance was up from last year’s event, which had been at the McEnery Convention Center in the waning days of the pandemic. I hope we’re getting back to normal, whatever that means.
This week, we have a few articles about Industry 4.0, as well as a column on setting your priorities. We have a cool article about methods for measuring the breakdown of resins during multiple thermal laminations, and a conversation with an EMS company president who realized that he was actually running a data collection firm that happened to make circuit boards. Can you say the same about your own company?
DesignCon 2022: Back to Business as Usual
Published April 7
This week, DesignCon returned to its old stomping grounds, the Santa Clara Convention Center in Silicon Valley. It’s been over two years since the annual design engineering event was last held here, and attendees and exhibitors were glad to be back to normal, more or less. Let’s congratulate Richard Mellitz of Samtec for taking home the “Engineer of the Year” award, along with finalists Scott McMorrow, Steven Sandler, and Design007 contributor Bert Simonovich. Nolan Johnson brings us this DesignCon wrap-up.
The Future is Driven by Data
Published April 7
History is full of “A-ha” moments, when inventors and leaders had that proverbial lightbulb turn on in their brain. In this interview with Rocket EMS President Michael Kottke, he discusses his DIY implementation of Industry 4.0 systems, and how everything changed with the realization that he is now running a data collection business that just happens to build printed circuit boards. Check it out.
Smart Factory Insights: Has the Industry 4.0 Gold Rush Ended?
Published April 6
Speaking of Industry 4.0, it’s hard to believe that this concept is now five years old, well past the toddler stage in life. But as columnist Michael Ford points out, the Gold Rush surrounding Industry 4.0 may have run its course. In this column, Michael discusses the various winners and losers who have risked it all for the chance of striking gold in this new territory.
The Right Approach: The Law of Priorities
Published April 7
With so many of us wearing multiple hats each day, setting priorities becomes a task in itself. Steve Williams has a column that a lot of us will identify with as he continues counting down the 21 Irrefutable Laws of Leadership. As Steve says, balancing your priorities will enable you to more thoroughly enjoy your career as well as your recreational time.
Measuring Multiple Lamination Reliability for Low-loss Materials
Published April 4
John Strubbe of TUC has a great article about the effects of multiple thermal lamination cycles on resin’s physical properties. He takes dynamic mechanical analysis, stress-strain curves, Young’s modulus, yield strength, and ultimate tensile strength, and boils it all down so that the rest of us can understand it. This is good stuff.
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.