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Solutions for Reflow and Wave Soldering Optimization, Inspection and Traceability from KIC at SMTconnect
April 11, 2022 | KICEstimated reading time: 1 minute

KIC will exhibit in Hall 4, Stand 452 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.
Electronics manufacturing today requires automated and real-time process control and traceability. Like SPI and AOI are for optical inspection, inspection of the production reflow temperature profile is a must. Can you imagine a line without SPI or AOI? So why go without it for reflow, cure, or wave soldering. Process control, traceability and quality solder joints can be delivered with real-time inspection capabilities. That is what KIC provides (and invented) for your thermal processes. This critical data should be a part of your overall Industry 4.0 smart factory solution to ensure all production through the oven is within specifications and that profile data is readily available for each individual board.
KIC has solutions for challenges such as handling process audits, automating manual profiling and data reporting tasks, MES connectivity, Industry 4.0 implementation, NPI process setup, reducing solder defects (voiding, head in pillow, tombstoning), and more.
The latest addition to the thermal process inspection family is KIC’s WPI, bringing its award-winning technology and thermal experience to the wave solder process. Wave Process Inspection provides users with automatic profiling – including an industry first dwell time and parallelism measurement for each production board – real-time preheat and wave analytics, automatic SPC charting and more.
KIC’s 45 years of experience in automated process data collection, direct service and support offices in every region, and more than 25,000 systems in the field brings the most reliable, accurate and innovative solutions for electronics manufacturing thermal process challenges. We are the experts in turning Heat To Data TM.
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Rachael Temple - AlltematedSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.