Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Koh Young America Participating at the SMTA Atlanta Expo & Tech Forum on 20 April 2022
April 12, 2022 | Koh YoungEstimated reading time: 1 minute
In support of the SMTA and its local chapters Koh Young, the industry leader in True3D measurement-based smart factory inspection solutions, will be supporting the SMTA Atlanta Expo & Tech Forum as a sponsor and exhibitor on Wednesday, 20 April 2022 at the Atlanta Technology Park located at 107 Technology Parkway in Peachtree Corners, Georgia. Register to attend for free technical sessions, lunch, and the change to network with Koh Young and others at SMTA's website.
At the SMTA event, just minutes away from Koh Young America’s Regional Headquarters in Duluth, Brent Fischthal, Senior Manager of Americas Marketing and Eastern Regional Sales will be onsite to discuss how True 3D inspection systems can help manufacturers characterize, optimize, and validate the electronics manufacturing process by using parametric measurement data from Koh Young inspection systems.
Aside from exhibitors like Koh Young, Expo attendees have an opportunity to gain experience from industry leaders:
- 9:00am Keynote Presentation: 2022 Semiconductor Challenges presented by Bill Bradford, Flip Electronics
- 10:30am Presentation: E-Mobility: Trends to Help Drive Your Business presented by Brian O'Leary, Indium
- 2:00pm Industry Roundtable: PCB Supply Chain Roundtable co-hosted by Gary Erickson & Joe Gibson, Sanmina
- 3:00pm Charity Raffle Drawing
- 4:00pm Happy Hour hosted by SMTA Atlanta at Anderby Brewing located next to the Atlanta Tech Center
Koh Young is always seeking top talent to continue building its best-in-class company.
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal (a free eBook available for download)
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e Book library here
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.