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MacDermid Alpha’s Electrolube Showcase Plant-Based Resins and Coatings at SMTconnect
April 12, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will showcase their newest advances in coating and resin technologies from Electrolube, at this year’s SMTconnect, held at the Nuremberg Messe from the 10th-12th May.
Electrolube, a brand of MacDermid Alpha will feature their newest, eco-friendly range of bio-based conformal coatings and resins on stand 125 in hall 4, which incorporates fast-curing UV cure coatings and the UR5645 high performance PU resin. The advanced new UVCLX is the first of its kind globally. UVCLX is a solvent-free, bio-based conformal coating that is completely unique to the industry and provides the highest levels of protection in a rapid processing time. Applied via a selective coating machine, UVCLX has been created with 75% of the organic content obtained from renewable sources and exceeds traditional UV Cure Coatings by being touch dry after just a short exposure to LED-365nm UV light. Other than other, traditional UV Cure Coatings, full cure is guaranteed in less than 24 hours due to its secondary chemical cure mechanism, which even cures shadowed areas in a matter of hours. UVCLX is transformational in comparison to traditional UV Cure Coatings, that can require weeks at a time for a complete cure and still with some shadowed areas remaining uncured. UVCLX significantly improves production time and provides even higher levels of performance, including resistance to cracking during thermal shock cycling.
The new bio-based polyurethane resin, UR5645 is a tough, two-part encapsulation system developed for the protection of electrical components in harsh environments. It features an excellent bio content of 63.33%. and is ideal for a wide range of applications including automotive and marine, due to its very low water absorption which enables continuous immersion in water at elevated temperatures and depth. UR5645 is a highly versatile resin with an operating temperature range of -50 to +150oC, (160oC for short excursions of 30 minutes dependent upon application and geometry). UR5645 is a low viscosity resin that benefits a faster and more efficient potting process. It also provides excellent chemical resistance to acids, alkalis and fuels, ideally suited for the harshest conditions, such as those found in automotive applications.
Electrolube, part of MacDermid Alpha Electronics Solutions, is leading the way in manufacturing plant-based electro-chemicals, offering customers protection solutions with high bio content. Bio-based materials, obtained from biological resources (biomasses, feedstock, plants, and biological waste), deliver a viable and sustainable alternative to materials derived from petrochemicals, and at Electrolube, we will continue to innovate new bio-based alternatives that have significantly less impact on the environment and meet the ethical needs of manufacturers and end users.
MacDermid Alpha Electronics Solutions enables electronics interconnection through the innovative specialty chemicals and materials from our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands. We serve all global regions and all steps of device manufacturing within every segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate with OEMs and fabricators in the implementation of new technologies that redefine what is possible in device design. Our world class technical service is constantly at hand to ensure optimized outcomes in yield and productivity. Our solutions can increase throughput, reduce carbon footprints, lower total cost of ownership, and enable electronics innovation.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Kimball Electronics Reports Q3 Results With Double-Digit Sequential Medical Sales Growth
05/07/2026 | Kimball ElectronicsKimball Electronics, Inc. announced financial results for the third quarter ended March 31, 2026.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
IMI Reports Stronger Performance and Return to Profitability in 2025
05/06/2026 | IMIIntegrated Microelectronics, Inc. (IMI) reported a significantly improved performance in 2025, reflecting the positive results of its multi year transformation focused on operational efficiency, portfolio optimization, and strengthening core capabilities.