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EVS International Signs on Competitive Edge Solutions in New England
April 13, 2022 | EVS InternationalEstimated reading time: 1 minute
EVS International, the leader in solder recovery, is pleased to announce that it has signed on Competitive Edge Solutions, LLC as its newest manufacturers’ representative. Dave Wilson, President, will represent EVS throughout the six New England states (MA, CT, RI, VT, NH, ME).
Understanding process/product needs and selecting the right equipment is critical to the success of your business. Competitive Edge Solutions has the resources to help your company gain an advantage, enhance a process, or develop a solution to a problem.
Competitive Edge Solutions has more than 25 years of practical experience in providing industry-leading equipment to exceed its customers’ needs. Dave Wilson, President of Competitive Edge Solutions, remarks “EVS International’s industry-leading solder recovery systems provide a unique solution to the high cost of materials, specifically Pb Free alloys, in a time of need. As the cost of alloys go up, every manufacturer can actively reduce their operating costs by utilizing this simple, easy to operate system. Let us show you how it works and the fast ROI it will produce.”
EVS’ new Solder Recovery Systems are fully lead-free compatible. Lead-free solder is used around the world and many EVS customers are using the EVS Solder Recovery Systems on all types of lead-free alloys (SAC305, SN100C and SAC X ECT).
The price of lead-free solder is three to four times that of present leaded solder so that the savings and payback from using EVS technology has leapt forward, making solder recovery the fastest payback of all circuit board assembly capital purchases.
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Julia McCaffrey - NCAB GroupSuggested Items
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ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.