Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
EVS International Signs on Competitive Edge Solutions in New England
April 13, 2022 | EVS InternationalEstimated reading time: 1 minute
EVS International, the leader in solder recovery, is pleased to announce that it has signed on Competitive Edge Solutions, LLC as its newest manufacturers’ representative. Dave Wilson, President, will represent EVS throughout the six New England states (MA, CT, RI, VT, NH, ME).
Understanding process/product needs and selecting the right equipment is critical to the success of your business. Competitive Edge Solutions has the resources to help your company gain an advantage, enhance a process, or develop a solution to a problem.
Competitive Edge Solutions has more than 25 years of practical experience in providing industry-leading equipment to exceed its customers’ needs. Dave Wilson, President of Competitive Edge Solutions, remarks “EVS International’s industry-leading solder recovery systems provide a unique solution to the high cost of materials, specifically Pb Free alloys, in a time of need. As the cost of alloys go up, every manufacturer can actively reduce their operating costs by utilizing this simple, easy to operate system. Let us show you how it works and the fast ROI it will produce.”
EVS’ new Solder Recovery Systems are fully lead-free compatible. Lead-free solder is used around the world and many EVS customers are using the EVS Solder Recovery Systems on all types of lead-free alloys (SAC305, SN100C and SAC X ECT).
The price of lead-free solder is three to four times that of present leaded solder so that the savings and payback from using EVS technology has leapt forward, making solder recovery the fastest payback of all circuit board assembly capital purchases.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.