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EVS International Signs on Competitive Edge Solutions in New England
April 13, 2022 | EVS InternationalEstimated reading time: 1 minute
EVS International, the leader in solder recovery, is pleased to announce that it has signed on Competitive Edge Solutions, LLC as its newest manufacturers’ representative. Dave Wilson, President, will represent EVS throughout the six New England states (MA, CT, RI, VT, NH, ME).
Understanding process/product needs and selecting the right equipment is critical to the success of your business. Competitive Edge Solutions has the resources to help your company gain an advantage, enhance a process, or develop a solution to a problem.
Competitive Edge Solutions has more than 25 years of practical experience in providing industry-leading equipment to exceed its customers’ needs. Dave Wilson, President of Competitive Edge Solutions, remarks “EVS International’s industry-leading solder recovery systems provide a unique solution to the high cost of materials, specifically Pb Free alloys, in a time of need. As the cost of alloys go up, every manufacturer can actively reduce their operating costs by utilizing this simple, easy to operate system. Let us show you how it works and the fast ROI it will produce.”
EVS’ new Solder Recovery Systems are fully lead-free compatible. Lead-free solder is used around the world and many EVS customers are using the EVS Solder Recovery Systems on all types of lead-free alloys (SAC305, SN100C and SAC X ECT).
The price of lead-free solder is three to four times that of present leaded solder so that the savings and payback from using EVS technology has leapt forward, making solder recovery the fastest payback of all circuit board assembly capital purchases.
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05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
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BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.