Indium Corporation to Present on e-Mobility at SMTA Michigan

Estimated reading time: 1 minute

Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Michigan Expo & Tech Forum at 9 a.m. local time, Tuesday, May 17, Livonia, Mich., U.S.

The automotive market is always on the cusp of innovation, as automakers and their suppliers adopt new technologies with each successive model generation. Today, start-ups and legacy automobile manufacturers makers are aggressively entering – and in some cases redefining – the electric vehicle (EV) space. Compared to their internal combustion engine counterparts, EVs implement a threefold increase in electronics with just a fraction of the mechanical parts leading to their moniker: “computers on wheels.”

In e-Mobility: Important Trends to Help Drive Your Business, O’Leary will discuss key trends in the EV market. Although the roadmap of some past technologies started in the U.S. only to later migrate offshore, the EV market is exhibiting robust U.S.-based sourcing and manufacturing. O’Leary will highlight how current and emerging trends could affect the commercial, technological, and supply chain markets, and participants will leave with a greater understanding of how their operations can compete in this competitive but expansive industry.

O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which include the markets for EVs, charging stations, and infrastructure, among others. He joined Indium Corporation in 2014 and has more than 20 years of experience in sales, marketing, and channel management in the electronics industry. He earned his master’s degree in international management at the Thunderbird School of Global Management at Arizona State University, Phoenix, Ariz. He also co-authored two books on thermal profiling: Profiling Guide for Profitability and Profiling Guide for Six Sigma.

Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.