Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Call For Papers For IPC APEX EXPO 2023
April 25, 2022 | IPCEstimated reading time: 1 minute
The newly appointed IPC APEX EXPO Technical Program Committee (TPC) is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2023 to be held at the San Diego Convention Center. The technical conference will take place January 24–26, 2023.
“The TPC – comprised of top technical leadership and subject matter experts from across the electronics industry – continues to build and strengthen the IPC APEX EXPO technical conference. A new committee chair and co-chair are leading the group through process improvements with a focus to provide stronger technical content spanning various technologies and the supply chain,” said Matt Kelly, IPC chief technologist. “The TPC’s mission is to deliver strong, relevant, and valuable technical programming that balances conventional technology advances with next-generation disruptive technologies. With these upgrades to the TPC, I’m excited to see what the IPC APEX EXPO 2023 technical conference has in store.”
Led by Stanton Rak, Ph.D., SF Rak Co. (Chair) and Udo Welzel, Ph.D., Robert Bosch GmbH (Co-Chair), the committee comprises the following members: Beverley Christian, Ph.D., HDP User Group; Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Eric Campbell, IBM; Hans-Peter Tranitz, Ph.D., Continental Automotive GmbH; Jason Keeping, Celestica Inc.; Kelly Scanlon, IPC; Martin Goetz, Northrop Grumman Corporation; Matt Kelly, IPC; Michael Ford, Aegis Industrial Software; Michael Carano; Milos Lazic, Indium Corporation; Paige Fiet, TTM Technologies, Inc.; Paul Cooke, Asahi Glass Co. Ltd.; Radu Diaconescu, Swissmic SA; Robert Kinyanjui, Ph.D., John Deere Electronic Solutions; Sarah Czaplewski-Campbell, IBM; Tim Burke, Ph.D., Arch Systems Inc.; Todd MacFadden, Bose Corporation; Laura Cohen, Ph.D., Continental Automotive; John Bauer, Collins Aerospace.
Technical conference paper and poster abstracts are due Monday, June 20, 2022. IPC seeks abstracts summarizing original and previously unpublished work describing significant results from research experiments, highlighting new techniques or materials, and/or discussing cutting-edge trends and challenges facing the electronics manufacturing industry.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
FTG Reports Strong Q1 2026 Results with Double-Digit Revenue Growth and Rising Backlog
04/09/2026 | Firan Technology Group CorporationIn Q1 2026, the Corporation grew organically. FTG is strategically investing its capital in ways that will drive increased shareholder returns for the future in both the near term and long term. The company's achievements in Q1 2026 demonstrate this commitment, laying a strong foundation for future growth.
EMI Promotes David Vue to Lead Military and Aerospace Division
03/31/2026 | Express Manufacturing Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, announced the promotion of David Vue to Military and Aerospace Division Manager.
SP Manufacturing Expands into UK Avionics Sector, Secures First Customer Engagement
03/30/2026 | SP ManufacturingSP Manufacturing Pte Ltd., a leader in comprehensive electronic manufacturing services, announced its expansion into the avionics sector in the United Kingdom, marked by the successful onboarding of its first UK-based avionics customer.
Honeywell Aerospace, Defense Department Sign Deal to Boost Defense Tech Production
03/27/2026 | PRNewswireHoneywell announced it has signed a groundbreaking supplier framework agreement with the U.S. Department of War (DoW) to rapidly increase the production of critical defense technologies. This agreement includes a $500 million multi-year investment to upgrade the company's production capacity.