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Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages

10/01/2025 | I-Connect007
I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.

Target Condition: Rethinking the PCB Stackup Recipe

10/01/2025 | Kelly Dack -- Column: Target Condition
Marie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.

Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025

09/25/2025 | Empower Semiconductor
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Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer

09/09/2025 | Summit Interconnect, Inc.
Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO). 

UHDI Fundamentals: UHDI Technology and Industry 4.0

09/03/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
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