Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
May 2022 Issue of SMT007 Magazine Available Now
May 2, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
For our May issue of SMT007 Magazine, we wanted to learn more about the challenges for high-mix, low-volume EMS firms building high density boards, and how they’re coping with those challenges. What we learned was that the high-density challenges, per se, were actually few and far between. What has been causing new headaches, however, is component packaging because of the unpredictability in the supply chain.
We look at new capabilities available to on-floor best practices, and how new best practices are likely to influence equipment design.
Download your copy today on the virtual newsstand or sign up for delivery in your e-mailbox by subscribing here.
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