For our May issue of SMT007 Magazine, we wanted to learn more about the challenges for high-mix, low-volume EMS firms building high density boards, and how they’re coping with those challenges. What we learned was that the high-density challenges, per se, were actually few and far between. What has been causing new headaches, however, is component packaging because of the unpredictability in the supply chain.
We look at new capabilities available to on-floor best practices, and how new best practices are likely to influence equipment design.
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