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MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions and Recycling Services at SMTA Michigan Expo & Tech Forum
May 3, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, May 17.
MacDermid Alpha has a portfolio of products proven to meet the most demanding electrical and thermo-mechanical reliability requirements of the automotive industry including solutions for safety, LED lighting, in-cabin electronics, underhood for powertrain related electronic systems, and electric vehicle - power electronics.
“When it comes to customer applications, not everyone has the same needs and requirements. For this reason, MacDermid Alpha has a broad line of solder pastes designed for resistance to both thermo-mechanical fatigue and electrochemical migration,” stated Scott Lewin, Regional Marketing Manager. “We are continually innovating with a portfolio of products proven to meet the most demanding requirements of the automotive industry.”
Alpha and Kester will feature their technologies engineered for enhanced reliability through ALPHA CVP-390V and Kester NP505-HR solder pastes with the industry-leading high-reliability Innolot alloy. Additionally, low-temperature solder pastes including Alpha’s recently launched, ALPHA OM-565 solder paste with HRL3 alloy will be promoted as well as the ALPHA HiTech portfolio of adhesive, underfill, and edgebond solutions.
In addition, a representative from MacDermid Alpha’s Reclaim and Recycling program will be available to discuss options for processing various types of assembly materials. With over thirty years of experience, MacDermid Alpha is North America’s largest solder manufacturer and recycler of electronics manufacturing waste. “We are committed to creating a more sustainable supply chain,” said Robert Wallace, Director of the Americas Reclaim Business. “We work closely with our customers to support their environmental initiatives for recycled products and managing their waste streams.”
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05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.