Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
ASC International Offers Affordable LaserVision 3D SPI
May 4, 2022 | ASC InternationalEstimated reading time: Less than a minute
ASC International, a leading manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, is pleased to offer the LaserVision SP3D Mini 3D Solder Paste Inspection system. The system offers the same level of overall measurement capabilities as the VisionPro SP3D, but utilizes a lower cost microscope platform and the ability for customers to supply their own PC if needed. The SP3D Mini sets the affordable boundary on reliable, low-cost SPI solutions.
The LaserVision SP3D Mini provides a powerful alternative to visual inspection of solder paste deposits, automatically calculating and storing critical printing characteristics in one click. The system enables ASC International to offer the same remarkable SPI technology found in their VisionPro and VisionPro AP Series models, but in an entry-level instrument. This makes LaserVision SP3D Mini ideal for manufacturers striving for better process control of the paste printing process, but working with a limited budget.
The SP3D Mini’s optional laser scanning feature provides 3D profiling capabilities along with added accuracy and repeatability due to increased data acquisition. This feature also provides a second layer of analysis to establish proper corrective actions based upon qualitative defect attributes.
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.