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Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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ASC International Offers Affordable LaserVision 3D SPI
May 4, 2022 | ASC InternationalEstimated reading time: Less than a minute
ASC International, a leading manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, is pleased to offer the LaserVision SP3D Mini 3D Solder Paste Inspection system. The system offers the same level of overall measurement capabilities as the VisionPro SP3D, but utilizes a lower cost microscope platform and the ability for customers to supply their own PC if needed. The SP3D Mini sets the affordable boundary on reliable, low-cost SPI solutions.
The LaserVision SP3D Mini provides a powerful alternative to visual inspection of solder paste deposits, automatically calculating and storing critical printing characteristics in one click. The system enables ASC International to offer the same remarkable SPI technology found in their VisionPro and VisionPro AP Series models, but in an entry-level instrument. This makes LaserVision SP3D Mini ideal for manufacturers striving for better process control of the paste printing process, but working with a limited budget.
The SP3D Mini’s optional laser scanning feature provides 3D profiling capabilities along with added accuracy and repeatability due to increased data acquisition. This feature also provides a second layer of analysis to establish proper corrective actions based upon qualitative defect attributes.
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